The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.

#computer #pc

Source: https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-says-hybrid-bonding-wont-be-ready-for-hbm4e-as-ai-memory-runs-into-a-775-micron-ceiling